The invention of
the Ultimate Accurate Surface Finish
The planarization is a technique that existed since ancient times and even today it is shouldering an important role as one of the processing technology backbones supporting IT (next generation information and communication technology), digital home electronics and semiconductors; the growing industries of the 21st century. At a foundation of elemental technologies in the fields such as optical parts for semiconductors, large caliber wafers and glass polishing, there is the limitless “surface creation technique” that gives a surface its finishing. In this field, that should be called an ultra-smooth surface process, a process that makes use the merits of each of the fixed abrasive process and loose abrasive process is necessary. This section introduces the efforts of Okamoto, a comprehensive abrasive processing tools manufacturer who owns the polishing technology cultivated in surface grinding technology and the semiconductor wafer process with a history of 50 odd years to meet the demands.



With the combination of a fixed abrasive process of the ultra-precision variable hydrostatic slide grinder and a loose abrasive process of the ultra-precision polishing machine, the straightness is 0.37 µm/m.
Flatness has reached 0.37 µm/m.
