Semiconductor Manufacturing Equipment
450mm Wafer Final Polisher PNX1200/PNX1200S
Polishing Machine 〜High-Rigidity Fully Automatic Final Polisher Meeting Next-Generation 450mm Wafer Requirements〜

Series Lineup

PNX1200・PNX1200S

Concept

The world’s first fully automated final polisher for 450mm wafers

Feature

・Designed for 450mm discs, it features a completely different and unique device configuration compared to the best-selling PNX332B 300mm final polisher.

・Polishing six pieces simultaneously from medium grinding to finishing on a three-table polishing stage.

・Ideal for remanufactured wafers requiring high polish removal rates and through-silicon via (TSV) processes.

・The SPP1200S is a manual single-table type.

※Photo shown with optional accessories.
Precision Surface Grinding Machine
Semiconductor Equipment Device
Peripheral
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