PNX332B/312

Final polisher featuring a special structure in the polishing head and transport mechanism, enabling stable wafer processing with high precision and high throughput.

・The best-selling 300mm final polisher.

・Achieves atomic-level ultra-mirror and ultra-high-brightness processing.

・This high-productivity machine simultaneously polishes six pieces from intermediate polishing to finishing polishing on its three-table polishing stage, and simultaneously transports four pieces using an indexing transport system.

・Ideal for remanufactured wafers requiring high polish removal rates and through-silicon via (TSV) processes.

・The PNX312 is a fully automatic single-table type.