Semiconductor-Related Manufacturing Equipment
Lapping Machine SPL Series
Lapping Machine 〜Lapping Machines with a Diverse Lineup〜

Series Lineup

SPL15F・SPL24・SPL32・SPL36・SPL120
*Requests for sizes beyond our standard lineup will require separate consultation.

Concept

From space-saving compact lap tables to large lap tables

Feature

・In the processing of electronic materials, metallic materials, optical flats, ceramics, SiC, GaN, and other materials, achieving nano-level flatness and surface roughness requires a lapping machine capable of adapting to various conditions.
 Our lapping machines offer a lineup that allows selection of equipment size, workpiece holding method, table material, slurry, and functions to meet customer requirements.
 All models are lapping machines that excel in operability and are suitable for mass production.
Additionally, a high-precision facing device can be included as an option. Program settings enable fully automatic correction of the base plate shape and groove cutting.

※Photo shown with optional accessories.
Precision Surface Grinding Machine
Semiconductor Equipment Device
Peripheral
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