Series Lineup
SPL15F・SPL24・SPL32・SPL36・SPL120
*Requests for sizes beyond our standard lineup will require separate consultation.
Concept
From space-saving compact wrap tables to large wrap tables
Feature
・In the processing of electronic materials, metallic materials, optical flats, ceramics, SiC, GaN, and other materials, achieving nano-level flatness and surface roughness requires a lapping machine capable of adapting to various conditions.
Our wrapping machines offer a lineup that allows selection of equipment size, workpiece holding method, table material, slurry, and functions to meet customer requirements.
All models are wrapping machines that excel in operability and are suitable for mass production.
Additionally, a high-precision facing device can be included as an option. Program settings enable fully automatic correction of the base plate shape and groove cutting.
