Semiconductor-related manufacturing equipment
CMP - Chemical Mechanical Polishing - SPP600S
Polishing Machine 〜Equipped with a wide range of software for research and development〜

Series Lineup

SPP600S・SPP800S・SPP1000S・SPP1200S

Concept

User-friendly CMP equipment designed with ease of use and environmental considerations in mind

Feature

・This manual-type CMP system is ideal for research and development applications. It supports various pressure control methods based on either the front or back surface. Its user-friendly interface allows you to monitor all processing conditions on a single screen.

・Primary time settings ensure consistently stable data collection. Data obtained from this unit can be linked with the fully automatic polisher PNX332B and used directly.

・Even when grinding with a removal rate of 10μm or more, wafer shape will not be compromised. It features a dedicated dresser spindle and is compatible with diamond dressers.
 Furthermore, it features environmentally conscious design elements such as a slurry recycling mechanism.

※Photo shown with optional accessories.
Precision Surface Grinding Machine
Semiconductor Equipment Device
Peripheral
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