SVG101MKⅡ・SVG401MKⅡ・SVG401H

High-rigidity grinder ideal for machining difficult-to-cut materials

・Manual grinder for research and development and grinding of difficult-to-cut materials. The SVG101 features a shuttle table and is designed to facilitate manual wafer loading and unloading.

・The SVG401 performs continuous machining of difficult-to-cut materials such as sapphire and SiC, as well as compound semiconductors, utilizing its high-rigidity structure and high-horsepower built-in motor.
　For batch processing of small-diameter wafers, a chuck table supporting up to 450mm diameter can be installed. (20-wafer batches of 3-inch wafers)